Hola! Este portátil me está volviendo loco.
Es un Aspire 5551G con placa base LA-5911P. Cuando pulso power enciende ventiladores pero no manda señal. Revisando la Power sequence en la pag.5, +CPU_CORE = 0,90V. Cuando continúo con las mediciones, el fallo desaparece y el portátil manda señal, llegando a funcionar perfectamente. Es un fallo aleatorio, porque más tarde, vuelve otra vez a fallar el encendido y cuando empiezo con las mediciones, vuelve a desaparecer la falla.
¿Alguna sugerencia?

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Hello! Portable this one madman is turning me. It is one Aspire 5551G with motherboard LA-5911P. When I pulsate power it ignites ventilators but it does not order sign. Checking the Power sequence in pag.5, +CPU_CORE = 0,90V. When I continue with the measurements, the failure disappears and the portable one orders sign, managing to work perfectly. It is a random failure, because later, it returns to trump again the ignition and when I begin with the measurements, returns to eliminate the fault.
Some suggestion?

Как на испанском будет "север поменяй"?

you need to change North Bridge

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ремонт ноутов по снимку платы
снятие паролей BIOSа на расстоянии
приворот winDOвSa

Лозовский Антон (RsM), по-ангельски я и сам могу... по-испански должно быть как-то так
necesita cambiar el Northbridge

Ok, voy primero hacer reflow y si todo va bien, entonces cambio north bridge.

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Ok, I go first to do reflow and if everything is OK, then I change north bridge.
Thank you.

Ok hice reflow a north bridge y el portátil hasta ahora no ha vuelto a fallar. En caso, de volver el problema, le hago reballing.
Gracias

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Ok I did reflow to north bridge and the portable one till now has not returned to fail. In case, to turn the problem, I do him reballing.
Thank you

о как... в Испании тоже прогревасты есть... прогрел, знач, денег взял, если вернется - отреболлю (суть - опять прогрею) ... а я-то думал это исключительно наша местная жлобская болячка.

jolinpc, sin reflow, sin reballing. sólo el reemplazo!

No, estás equivocado... Le he explicado al cliente la situación y en caso de regresar, entonces le hago reballing...

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Not, you are wrong... I have explained the situation to the client and in case of returning, then I do him reballing...

Дядя Женя, упертого прогреваста утюг или терморектальный криптоанализатор только исправит

_________________
уволился
------------------------------------------------
ремонт ноутов по снимку платы
снятие паролей BIOSа на расстоянии
приворот winDOвSa

and you think that reballing is the corrent solution? the problem usually is not between the mobo <> chip, but inside the chip, need to REPLACE it

No siempre el problema es el chip. En la mayoría de los casos, hacemos reballing y los equipos no regresan, ya que el problema está en las bolas de soldadura y no en el chip. En otros casos, después de hacer reballing, en un corto plazo, los equipos regresan, y es entonces cuando procedemos al cambio de chip.
¿Qué sentido tiene cambiar algo que está funcionando bien cuando el problema es la conexión o el contacto? De esta forma, el cliente se ahorra dinero, ya que en caso de tener que cambiar chip se le cobra sólo la diferencia.
Aquí en España la gran mayoría ofrecen 3 meses de garantía en reparaciones y nosotros siempre ofrecemos 6.
Eso sí, también explicamos a nuestros clientes el método de trabajo a seguir en la reparación.

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Not always the problem is the chip. In most cases, we do reballing and the equipments do not return, since the problem is in the balls of weld and not in the chip. In other cases, after doing reballing, in a short term, the equipments return, and it is at the time when we proceed at the rate of chip. What sense has it to change something that is working well when the problem is the connection or the contact? Of this form, the client saves himself money, since in case of having to change chip one receives from him only the difference. Here in Spain the great majority they offer 3 months of guarantee in repairs and we always offer 6. It yes, also we explain the method of work to our clients to continuing in the repair.

Please don't think that everyone is wrong and you are magically right, only inexperienced starting engineers do that and you can get a ban here for spreading misinformation. It is funny that new people thinking like you are still appearing sometimes, it looks like it will never end

~99% of popular nvidia chips fail inside them, the contact between the silicon crystal and chip base. Not the contacts between the mobo <> chip base. You can confirm it by applying mechanical pressure, almost NONE of the chips will react to it. While if it really were this particular problem, then it would react to pressure.

By doing reflow or reball process you are only temporarily restoring the contacts inside the chip. The warranty return rate means nothing here, it is random, you have to stop making wrong conclusions, because you are fooling yourself also. You should know that a failing nvidia chip can be temporarily restored by the heating cycle (reflow ir reball) for a totally random time. Sometimes it works for a year. By doing reball instead of reflow it usually works longer, because the chip gets 2x or more total heat amount/time. It is true that reballing makes the chip work for a longer time than a single reflow, but the same can be achieved by just heating it (or reflowing) 2x or more times. So by doing a reball here you are only stupidly wasting your solder balls, because the same result can be achieved by doing few more or longer reflows in a row. And neither of those procedures can be called a real repair, or a professional repair.

And even if we are talking about the 1% of the cases when the problem is between the mobo <> chip, it is best to replace the chip, as it will fail soon anyway because of it's age, 100% nvidia chips that belong to the models that were manufactured using a faulty manufacturing process WILL fail. There is plenty of technical articles describing this problem.

http://www.theinquirer.net/inquirer/new ... -underfill
http://www.theinquirer.net/inquirer/new ... 4-g86s-bad
http://www.theinquirer.net/inquirer/new ... -defective
http://www.theinquirer.net/inquirer/new ... a-55nm-bad

And don't you think that it's a little bit strange that only nvidia and ati chips react to reflow/reball and not the intel? Do you think the motherboard manufacturers are soldering intel chips differently? Time to use your head to make some logical conclusions, no? But you are also free to believe what you want...

Yes, you are partially right. Some of the issues you are describing are really because of the poor connection. But this case is not the same. The problem with *001 northbridge is well known and can be easily located by direct heating of the chrystal. Just keep in mind that soldering balls is not melting under the chip plate thus a lost contact between the chip and a mobo coldn`t be fixed but why the mobo is starting up ? The answer is simple - because of the poor connection between the chrystal and the chip plate that is temporarily restored by direct heating of the chrystal.

Let me correct you a bit. Most of previous generations of Intel chips had pretty big square so had a lot of problems with poor contacts between the chips and mobos when laptops were bitten or fallen because of deformations of the mobos . So the reflow/reball were really efficient.

Ofcourse, and I didn't say that it was otherwise What I had in mind was something for the topicstarter to think about, to be precise - about the chip's reaction to heat while doing the reflow/reball procedure, I didn't mean the reflow/reball process in it's primary use where it was appropriate for ages, and it still is, there is absolutely no doubt about it I am trying to force the topicstarter to think a little bit and make some logical conclusions. Maybe I should have written "react to heat" and not "react to reflow/reball", but I thought that it was clear enough

Historically people got confused from the moment when faulty nvidia and ati chips started reacting to the heat of reflow/reball, from that moment 99% of them were doing reflows and reballs without knowing the hidden details of the real problem And I can't imagine why no one ever questioned as to why only the nvidia and ati chips were becoming "desoldered from the mobo" and not the intel, and why after the reball (heat) procedure they still were becoming desoldered and why ati chips even after full reball were becoming desoldered earlier than nvidia chips etc.. - they just stupidly heated heated and heated... EVERYTHING

P.S.: just to be safe, there is no doubt that any chip can get desoldered (they were, and they still are sometimes), all I am saying that people should use their heads to determine exactly which problem (or both at the same time, possibly) they are dealing with, it is not that hard

P.P.S.: logically for someone who is working with it and solders a lot of chips, it should look a little bit suspicious that even the largest intel chips, after the reball were never becoming "unsoldered from the motherboard" , and yet somehow even much smaller nvidia or ati chips, even after the full reball were become "unsoldered" (as if ), using same solder balls, same soldering flux, same soldering profile? And all of that difference happening out of nowhere? And for some unclear reason a new nvidia/ati chip doesn't become "unsoldered" for few years. People are stupid конец фильма

They just want to save some money - that`s all. It is "good" when they want to save client`s money and it is sad when own.
Anyway that is all "monkey buisness"..

здесь у нас за последние несколько лет этих прогревастов-пендюра..стов стока появилось что просто жо..а... процентов 80 всех "типа сервисов" - тупые прогревасты, цены скинули ниже плинтуса что даже узкапопые отдыхают. работают по принципу : "прожарю... заработало - бабло, нет -меняйте плату или в другой сервис"... тока после 2-3-4-5... сервисов клиент приходит с в жо.у убитой платой, и просит чтобы ему сделали по тойже цене как ему предлогали прогревасты - это печально