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Добрый день!
Интересует эта статья по поводу того как готовить новый чип к установке.
На сколько это правда?
Выкладываю без перевода, т.к. не знаю как лучше переводить тех.термины.
Chips need to bake under Applicable temperature of baking: 95C-100C within 48 hours.it is a must,so that the chips can be used.If the chips been put a long time,there will be water inside it,need to bake it,the water inside chip will cause a short circuit.do you have bake box?
Note:
Replacement of north and south bridge, graphics chip technology requires a higher temperature, a slight deviation, offset or pad solder joint cleanliness is not high may cause replacement fails, the operator needs a higher level of experience and practice.
The other is a general repair shop to prepare the existing data is difficult to detect 100% of the motherboard failure is caused by damage to the north and south bridge! Therefore, replacement of the north and south bridge friends after the fault is still not resolved, please do not blame the bridge of poor quality.Friend.
The standard number of BGA chip temperature
A solder ball melting temperature 183, 217 lead-free solder ball melting temperature.
Welding zone settings is generally recommended temperature melting point higher than the 15 - 20 degrees, above the liquid to keep 30 - 60S.
BGA's custody and baking temperature
BGA Control Specification
1 BGA unpacking and storage
(1) vacuum packaging of BGA to be stored in unopened at temperatures below 30 ° C, relative humidity less than 90% of the environment, the use of a period of one year.
(2) vacuum packaging has been opened opened the BGA must indicate the time, not on the line of BGA, stored in a moisture-proof cabinets, storage conditions, ≤ 25 ° C, 65% RH, storage period of 72hrs.
(3) if the line opened on the BGA but not used or surplus materials must be stored in the Cabinets in (conditions ≤ 25 ℃, 65% RH), if returned to the Treasury of the BGA large baked by the large warehouse, large warehouse changes stored in vacuum packaging.
2 BGA baking
(1) over storage period, the shall be 100 ° C/48hrs baking (if several hours of baking the baking must be less than the total 96hrs), order on-line use.
(2) If the parts have a special baking regulator, separate into the SOP.
PCB Control Specification
1 PCB unpacking and storage
(1) PCB board sealed unopened within 2 months of the date of manufacture can be used directly on-line
(2) PCB board manufacture date in 2 months, opened opened after the date must be marked
(3) PCB board manufacture date in 2 months, 5 days after unpacking must be completed on-line use
2 PCB Baking
(1) PCB manufacture date 2 months in a sealed opened more than 5 days, please write to 120 ± 5 ℃ bake 1 hour
(2) PCB manufacture date if more than 2 months, on the line before to 120 ± 5 ℃ bake 1 hour
(3) PCB manufacture date in excess of 2 to 6 months, on the line before to 120 ± 5 ℃ bake 2 hours
(4) PCB manufacture date in excess of 6 months to 1 year, on-line before baking to 120 ± 5 ℃ 4 hours
(5) baking the PCB must be within 5 days after use (into the IR REFLOW), bit used up you need to 1 hour before baking and then use the on-line
(6) PCB manufacture date if more than 1 year, on-line before baking to 120 ± 5 ℃ 4 hours, sending HASL PCB plant before re-use on-line
3 PCB baking methods
(1) a large PCB (16 PORT containing more than 16 PORT) adopt flat-type display, a stack of maximum number of 30, complete the baking oven 10 minutes, remove the PCB within the open flat natural cooling (to be pressed against plate Bay fixture)
(2) small and medium sized PCB (8PORT the following with 8PORT) adopt flat is located, the number of a stack of up to 40, unlimited vertical, open the baking oven 10 minutes to complete remove the PCB flat natural cooling (subject to pressure anti- Plate Cove fixture)
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